Residential College | false |
Status | 已發表Published |
Efficiency Improvement of Quantum Dot Light-Emitting Diodes via Thermal Damage Suppression with HATCN | |
Liu, R.J.1; Dong, J.Y.1; Wang, M.W.1; Yuan, Q.L.1,3; Ji, W.Y.3; Xu, J.C.1; Liu, W.W.1,2; Su, S.C.4,5; Ng, K.W.1; Tang, Z.K.1; Wang, S.P.1 | |
2021-10-20 | |
Source Publication | ACS Applied Materials & Interfaces |
ISSN | 1944-8244 (print); 1944-8252 (web) |
Volume | 13Issue:41Pages:49058-49065 |
Abstract | With many advantages including superior color saturation and efficiency, quantum dot light-emitting diodes (QLEDs) are considered a promising candidate for the next-generation displays. Emission uniformity over the entire device area is a critical factor to the overall performance and reliability of QLEDs. In this work, we performed a thorough study on the origin of dark spots commonly observed in operating QLEDs and developed a strategy to eliminate these defects. Using advanced cross section fabrication and imaging techniques, we discovered the occurrence of voids in the organic hole transport layer and directly correlated them to the observed emission nonuniformity. Further investigations revealed that these voids are thermal damages induced during the subsequent thermal deposition of other functional layers and can act as leakage paths in the device. By inserting a thermo-tolerant 1,4,5,8,9,11-hexaazatriphenylene-hexacarbonitrile (HATCN) interlayer with an optimized thickness, the thermally induced dark spots can be completely suppressed, leading to a current efficiency increase by 18%. We further demonstrated that such a thermal passivation strategy can work universally for various types of organic layers with low thermal stability. Our findings here provide important guidance in enhancing the performances and reliability of QLEDs and also other sandwich-structured devices via the passivation of heat-sensitive layers. |
Keyword | Qled Interface Thermal Damage Interlayer Current Efficiency |
DOI | 10.1021/acsami.1c16034 |
URL | View the original |
Indexed By | SCIE |
Language | 英語English |
WOS Research Area | Science & Technology - Other Topics ; Materials Science |
WOS Subject | Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary |
WOS ID | WOS:000710924900070 |
Publisher | AMER CHEMICAL SOC, 1155 16TH ST, NW, WASHINGTON, DC 20036 |
The Source to Article | PB_Publication |
Scopus ID | 2-s2.0-85117778954 |
Fulltext Access | |
Citation statistics | |
Document Type | Journal article |
Collection | INSTITUTE OF APPLIED PHYSICS AND MATERIALS ENGINEERING University of Macau |
Corresponding Author | Ng, K.W.; Tang, Z.K.; Wang, S.P. |
Affiliation | 1.Joint Key Laboratory of the Ministry of Education, Institute of Applied Physics and Materials Engineering, University of Macau, Avenida da Universidade, Taipa, 999078, Macao 2.Department of Physics and Electronic Engineering, Yancheng Teachers University, Yancheng, 224002, China 3.Key Lab of Physics and Technology for Advanced Batteries (Ministry of Education), College of Physics, Jilin University, Changchun, 2699 Qianjin Street, 130012, China 4.Institute of Semiconductor Science and Technology, South China Normal University, Guangzhou, 510631, China 5.SCNU Qingyuan Institute of Science and Technology Innovation Co., Ltd., Qingyuan, 511517, China |
First Author Affilication | INSTITUTE OF APPLIED PHYSICS AND MATERIALS ENGINEERING |
Corresponding Author Affilication | INSTITUTE OF APPLIED PHYSICS AND MATERIALS ENGINEERING |
Recommended Citation GB/T 7714 | Liu, R.J.,Dong, J.Y.,Wang, M.W.,et al. Efficiency Improvement of Quantum Dot Light-Emitting Diodes via Thermal Damage Suppression with HATCN[J]. ACS Applied Materials & Interfaces, 2021, 13(41), 49058-49065. |
APA | Liu, R.J.., Dong, J.Y.., Wang, M.W.., Yuan, Q.L.., Ji, W.Y.., Xu, J.C.., Liu, W.W.., Su, S.C.., Ng, K.W.., Tang, Z.K.., & Wang, S.P. (2021). Efficiency Improvement of Quantum Dot Light-Emitting Diodes via Thermal Damage Suppression with HATCN. ACS Applied Materials & Interfaces, 13(41), 49058-49065. |
MLA | Liu, R.J.,et al."Efficiency Improvement of Quantum Dot Light-Emitting Diodes via Thermal Damage Suppression with HATCN".ACS Applied Materials & Interfaces 13.41(2021):49058-49065. |
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