Residential College | false |
Status | 已發表Published |
Trending IC design directions in 2022 | |
Chan, Chi Hang1; Cheng, Lin2; Deng, Wei3; Feng, Peng4; Geng, Li5; Huang, Mo1; Jia, Haikun3; Jie, Lu3; Lei, Ka Meng1; Liu, Xihao5; Liu, Xun6; Liu, Yongpan3; Lu, Yan1; Nie, Kaiming7; Pan, Dongfang2; Qi, Nan4; Sin, Sai Weng1; Sun, Nan3; Sun, Wenyu3; Xu, Jiangtao7; Yue, Jinshan3; Zhang, Milin3; Zhang, Zhao4 | |
2022-07-01 | |
Source Publication | Journal of Semiconductors |
ISSN | 1674-4926 |
Volume | 43Issue:7Pages:071401 |
Abstract | For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially; and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit (IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence (AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works. |
Keyword | Artificial Intelligence (Ai) Biomedical Cryogenic Data Converters Imager Integrated Circuit Design Power Management Radio Frequency (Rf) Circuits Sensor |
DOI | 10.1088/1674-4926/43/7/071401 |
URL | View the original |
Indexed By | ESCI |
Language | 英語English |
WOS Research Area | Physics |
WOS Subject | Physics, Condensed Matter |
WOS ID | WOS:000828344400001 |
Scopus ID | 2-s2.0-85135246602 |
Fulltext Access | |
Citation statistics | |
Document Type | Journal article |
Collection | INSTITUTE OF MICROELECTRONICS Faculty of Science and Technology |
Corresponding Author | Lu, Yan |
Affiliation | 1.University of Macau, 999078, Macao 2.University of Science and Technology of China, Hefei, 230026, China 3.Tsinghua University, Beijing, 100084, China 4.Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China 5.Xi'an Jiaotong University, Xi'an, 710049, China 6.Chinese University of Hong Kong, Shenzhen, 518172, China 7.Tianjin University, Tianjin, 300072, China |
First Author Affilication | University of Macau |
Corresponding Author Affilication | University of Macau |
Recommended Citation GB/T 7714 | Chan, Chi Hang,Cheng, Lin,Deng, Wei,et al. Trending IC design directions in 2022[J]. Journal of Semiconductors, 2022, 43(7), 071401. |
APA | Chan, Chi Hang., Cheng, Lin., Deng, Wei., Feng, Peng., Geng, Li., Huang, Mo., Jia, Haikun., Jie, Lu., Lei, Ka Meng., Liu, Xihao., Liu, Xun., Liu, Yongpan., Lu, Yan., Nie, Kaiming., Pan, Dongfang., Qi, Nan., Sin, Sai Weng., Sun, Nan., Sun, Wenyu., ...& Zhang, Zhao (2022). Trending IC design directions in 2022. Journal of Semiconductors, 43(7), 071401. |
MLA | Chan, Chi Hang,et al."Trending IC design directions in 2022".Journal of Semiconductors 43.7(2022):071401. |
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