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Multilayer packaging dual-band balanced bandpass filter based on dual-mode substrate integrated waveguide cavities with split-type topology
Xiaohang Sun1; Xin Zhou2; Yibing Li1; Xiaojun Gu1; Bin Xu1; Kam Weng Tam3; Gang Zhang2
2022-11-08
Source PublicationIET Microwaves Antennas & Propagation
ISSN1751-8725
Volume17Pages:200-207
Abstract

A new design method of the dual-band balanced bandpass filter (BPF) using multilayer packaging dual-mode substrate integrated waveguide (SIW) cavities is proposed. Split-type coupling topology based on dual-mode resonators is developed for the design. Firstly, a single-band balanced filter with perturbed metal vias is designed. The TE mode and the TE mode perturbed by the metal vias can form a passband. Secondly, an additional metal vias perturbed SIW cavity with the same dual-mode is placed in the lower layer for the bandstop function. A dual-band balanced BPF with split-type coupling topology is successfully realised. Compared with the traditional cascaded single-mode form, the proposed dual-mode split-type design has more compact size and can be more easily extended to multi-passbands. To verify the proposed method, a dual-band balanced filter operating at 13.3 and 14.2 GHz is designed, fabricated and measured. The designed dual-band balanced filter has good filtering performance including differential mode passband transmission and common mode rejection. Measured results show good agreements with simulated ones.

DOI10.1049/mia2.12320
URLView the original
Indexed BySCIE
Language英語English
WOS Research AreaEngineering ; Telecommunications
WOS SubjectEngineering, Electrical & Electronic ; Telecommunications
WOS IDWOS:000880047200001
PublisherWILEY, 111 RIVER ST, HOBOKEN 07030-5774, NJ
Scopus ID2-s2.0-85141589832
Fulltext Access
Citation statistics
Document TypeJournal article
CollectionDEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Faculty of Science and Technology
Corresponding AuthorXiaojun Gu
Affiliation1.Hengdian Electronics Co., Ltd., Nanjing, China
2.School of Electrical and Automation Engineering and the Jiangsu Key Laboratory of 3D PrintingEquipmentand Manufacturing ,Nanjing Normal University, Nanjing, China
3.Department of Electrical and Computer Engineering, Faculty of Science and Technology, University of Macau, Macau, China
Recommended Citation
GB/T 7714
Xiaohang Sun,Xin Zhou,Yibing Li,et al. Multilayer packaging dual-band balanced bandpass filter based on dual-mode substrate integrated waveguide cavities with split-type topology[J]. IET Microwaves Antennas & Propagation, 2022, 17, 200-207.
APA Xiaohang Sun., Xin Zhou., Yibing Li., Xiaojun Gu., Bin Xu., Kam Weng Tam., & Gang Zhang (2022). Multilayer packaging dual-band balanced bandpass filter based on dual-mode substrate integrated waveguide cavities with split-type topology. IET Microwaves Antennas & Propagation, 17, 200-207.
MLA Xiaohang Sun,et al."Multilayer packaging dual-band balanced bandpass filter based on dual-mode substrate integrated waveguide cavities with split-type topology".IET Microwaves Antennas & Propagation 17(2022):200-207.
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