A new flexible manufacturing process for tailoring release rates in controlled release packaging and drug delivery systems

Status	已發表Published
	A new flexible manufacturing process for tailoring release rates in controlled release packaging and drug delivery systems
	Jin X.2; Zumbrunnen D.A.2; Balasubramanian A.1; Yam K.1
	2009-11-25
Source Publication	Annual Technical Conference - ANTEC, Conference Proceedings
Volume	5
Pages	2521-2525
Abstract	Smart blenders controllably form multi-component polymer melts into a wide variety of fine-scale structural arrangements. The machines operate on the principal of chaotic advection, a recent subfield of fluid mechanics. Because structure of a composite material influences greatly additive diffusion and matrix dissolution, this processing method may be useful for designing medications, transdermal patches, implants, and sutures in medical applications. It may also provide desired release rates of active compounds such as antioxidants and antimicrobial from packaging films to enhance the quality and safety of food. In this paper, an ability to alter release rates of tocopherol, a natural antioxidant, is demonstrated via on-line specification of a process parameter governing blend morphology in extruded films.
Keyword	Active packaging Chaotic advection Chaotic mixing Controlled release Drug delivery Smart blending
URL	View the original
Language	英語English
Fulltext Access	View Full-Text via Scopus
Document Type	Conference paper
Collection	University of Macau
Affiliation	1.Rutgers, The State University of New Jersey 2.Clemson University
Recommended Citation GB/T 7714	Jin X.,Zumbrunnen D.A.,Balasubramanian A.,et al. A new flexible manufacturing process for tailoring release rates in controlled release packaging and drug delivery systems[C], 2009, 2521-2525.
APA	Jin X.., Zumbrunnen D.A.., Balasubramanian A.., & Yam K. (2009). A new flexible manufacturing process for tailoring release rates in controlled release packaging and drug delivery systems. Annual Technical Conference - ANTEC, Conference Proceedings, 5, 2521-2525.

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