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Multilayer Packaged Single- and Dual-Band Dual-Channel Bandpass Filters Based on Substrate Integrated Waveguide Cavities
Zhang, Gang1; Zhou, Xin2; Hu, Jianhui1; Tam, Kam Weng2; Li, Desen2; Zhang, Zhuowei2; Ma, Tianye3; Yang, Jiquan1
2023
Source PublicationIEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN2156-3950
Volume14Issue:1Pages:114-121
Abstract

This article presents a design method for multilayer packaged single- and dual-band dual-channel bandpass filters (DCBPFs) based on square substrate integrated waveguide (SIW) cavities. By exploiting one or multiple pairs of orthogonal degenerate modes in square SIW resonators, two single-band and one dual-band DCBPFs with high channel isolations are implemented. By arranging feeding ports and coupling apertures, a highly selective single-band DCBPF with multiple types of operating states is demonstrated. In order to construct dual-band DCBPF design, balanced feeding ports are introduced to excite the operating modes and suppress unwanted spurious modes between the dual passbands, thus realizing a satisfactory dual-band frequency response. To validate the design method, two single-band and one dual-band prototypes are designed, fabricated, and measured. The results exhibit excellent filtering performance and high channel-to-channel isolations.

KeywordBandpass Filter (Bpf) Couplings Dual Band Dual-channel Filtering Isolation Multilayer Nonhomogeneous Media Orthogonal Degenerate Mode Resonant Frequency Resonators Substrate Integrated Waveguide (Siw) Substrates
DOI10.1109/TCPMT.2023.3330170
URLView the original
Indexed BySCIE
Language英語English
WOS Research AreaEngineering ; Materials Science
WOS SubjectEngineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS IDWOS:001178135100007
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141
Scopus ID2-s2.0-85177076757
Fulltext Access
Citation statistics
Document TypeJournal article
CollectionFaculty of Science and Technology
DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Corresponding AuthorTam, Kam Weng; Ma, Tianye
Affiliation1.School of Electrical and Automation Engineering, Jiangsu Key Laboratory of3D Printing Equipment and Manufacturing, Nanjing Normal University, Nanjing, China
2.Department of Electrical and Computer Engineering, Faculty of Science and Technology, University of Macau, Macao SAR, China
3.Key Laboratory of Antenna and Microwave Technology, Nanjing Research Institute of Electronics Technology, Nanjing, China
Corresponding Author AffilicationFaculty of Science and Technology
Recommended Citation
GB/T 7714
Zhang, Gang,Zhou, Xin,Hu, Jianhui,et al. Multilayer Packaged Single- and Dual-Band Dual-Channel Bandpass Filters Based on Substrate Integrated Waveguide Cavities[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 14(1), 114-121.
APA Zhang, Gang., Zhou, Xin., Hu, Jianhui., Tam, Kam Weng., Li, Desen., Zhang, Zhuowei., Ma, Tianye., & Yang, Jiquan (2023). Multilayer Packaged Single- and Dual-Band Dual-Channel Bandpass Filters Based on Substrate Integrated Waveguide Cavities. IEEE Transactions on Components, Packaging and Manufacturing Technology, 14(1), 114-121.
MLA Zhang, Gang,et al."Multilayer Packaged Single- and Dual-Band Dual-Channel Bandpass Filters Based on Substrate Integrated Waveguide Cavities".IEEE Transactions on Components, Packaging and Manufacturing Technology 14.1(2023):114-121.
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