Residential College | false |
Status | 已發表Published |
34.6 A 28nm 72.12TFLOPS/W Hybrid-Domain Outer-Product Based Floating-Point SRAM Computing-in-Memory Macro with Logarithm Bit-Width Residual ADC | |
Yuan, Yiyang1,2; Yang, Yiming3; Wang, Xinghua3; Li, Xiaoran3; Ma, Cailian1,2; Chen, Qirui3; Tang, Meini3; Wei, Xi3; Hou, Zhixian3; Zhu, Jialiang1,2; Wu, Hao1,2; Ren, Qirui1,2; Xing, Guozhong1; Mak, Pui In4; Zhang, Feng1 | |
2024 | |
Conference Name | 2024 IEEE International Solid-State Circuits Conference (ISSCC) |
Source Publication | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
Pages | 576-578 |
Conference Date | 18-22 February 2024 |
Conference Place | San Francisco |
Country | USA |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Abstract | SRAM-based computing-in-memory (CIM) is considered crucial to achieving high-energy efficiency (EF) for artificial-intelligence (AI) applications on edge devices. Researchers are currently exploring floating-point (FP) CIM [1], [2], as integer (INT) precision CIMs [3] -[6] are no longer sufficient for new AI applications, which demand increased accuracy, complexity, and on-chip training. However, both analog and digital FP-CIMs face several significant challenges in realizing FP calculations, due to difficulties associated with handling high-bit precision: including (1) effectively combining the advantages of analog and digital CIMs while mitigating their respective drawbacks for high-bit-precision processing; (2) achieving optimal design trade-off for an analog-digital converter (ADC) necessitates the simultaneous consideration of bit precision, throughput, and overhead; (3) addressing the need for large fan-in multi-level adder trees in inner-based CIMs to sum high-bit-precision partial products, which can adversely impact overall EF, as shown in Fig. 34.6.1. |
DOI | 10.1109/ISSCC49657.2024.10454313 |
URL | View the original |
Language | 英語English |
Scopus ID | 2-s2.0-85188073944 |
Fulltext Access | |
Citation statistics | |
Document Type | Conference paper |
Collection | Faculty of Science and Technology DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING |
Corresponding Author | Wang, Xinghua; Zhang, Feng |
Affiliation | 1.Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China 2.University of Chinese Academy of Sciences, Beijing, China 3.Beijing Institute of Technology, Beijing, China 4.University of Macau, Macao |
Recommended Citation GB/T 7714 | Yuan, Yiyang,Yang, Yiming,Wang, Xinghua,et al. 34.6 A 28nm 72.12TFLOPS/W Hybrid-Domain Outer-Product Based Floating-Point SRAM Computing-in-Memory Macro with Logarithm Bit-Width Residual ADC[C]:Institute of Electrical and Electronics Engineers Inc., 2024, 576-578. |
APA | Yuan, Yiyang., Yang, Yiming., Wang, Xinghua., Li, Xiaoran., Ma, Cailian., Chen, Qirui., Tang, Meini., Wei, Xi., Hou, Zhixian., Zhu, Jialiang., Wu, Hao., Ren, Qirui., Xing, Guozhong., Mak, Pui In., & Zhang, Feng (2024). 34.6 A 28nm 72.12TFLOPS/W Hybrid-Domain Outer-Product Based Floating-Point SRAM Computing-in-Memory Macro with Logarithm Bit-Width Residual ADC. Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 576-578. |
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