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34.6 A 28nm 72.12TFLOPS/W Hybrid-Domain Outer-Product Based Floating-Point SRAM Computing-in-Memory Macro with Logarithm Bit-Width Residual ADC
Yuan, Yiyang1,2; Yang, Yiming3; Wang, Xinghua3; Li, Xiaoran3; Ma, Cailian1,2; Chen, Qirui3; Tang, Meini3; Wei, Xi3; Hou, Zhixian3; Zhu, Jialiang1,2; Wu, Hao1,2; Ren, Qirui1,2; Xing, Guozhong1; Mak, Pui In4; Zhang, Feng1
2024
Conference Name2024 IEEE International Solid-State Circuits Conference (ISSCC)
Source PublicationDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Pages576-578
Conference Date18-22 February 2024
Conference PlaceSan Francisco
CountryUSA
PublisherInstitute of Electrical and Electronics Engineers Inc.
Abstract

SRAM-based computing-in-memory (CIM) is considered crucial to achieving high-energy efficiency (EF) for artificial-intelligence (AI) applications on edge devices. Researchers are currently exploring floating-point (FP) CIM [1], [2], as integer (INT) precision CIMs [3] -[6] are no longer sufficient for new AI applications, which demand increased accuracy, complexity, and on-chip training. However, both analog and digital FP-CIMs face several significant challenges in realizing FP calculations, due to difficulties associated with handling high-bit precision: including (1) effectively combining the advantages of analog and digital CIMs while mitigating their respective drawbacks for high-bit-precision processing; (2) achieving optimal design trade-off for an analog-digital converter (ADC) necessitates the simultaneous consideration of bit precision, throughput, and overhead; (3) addressing the need for large fan-in multi-level adder trees in inner-based CIMs to sum high-bit-precision partial products, which can adversely impact overall EF, as shown in Fig. 34.6.1.

DOI10.1109/ISSCC49657.2024.10454313
URLView the original
Language英語English
Scopus ID2-s2.0-85188073944
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Citation statistics
Document TypeConference paper
CollectionFaculty of Science and Technology
DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Corresponding AuthorWang, Xinghua; Zhang, Feng
Affiliation1.Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
2.University of Chinese Academy of Sciences, Beijing, China
3.Beijing Institute of Technology, Beijing, China
4.University of Macau, Macao
Recommended Citation
GB/T 7714
Yuan, Yiyang,Yang, Yiming,Wang, Xinghua,et al. 34.6 A 28nm 72.12TFLOPS/W Hybrid-Domain Outer-Product Based Floating-Point SRAM Computing-in-Memory Macro with Logarithm Bit-Width Residual ADC[C]:Institute of Electrical and Electronics Engineers Inc., 2024, 576-578.
APA Yuan, Yiyang., Yang, Yiming., Wang, Xinghua., Li, Xiaoran., Ma, Cailian., Chen, Qirui., Tang, Meini., Wei, Xi., Hou, Zhixian., Zhu, Jialiang., Wu, Hao., Ren, Qirui., Xing, Guozhong., Mak, Pui In., & Zhang, Feng (2024). 34.6 A 28nm 72.12TFLOPS/W Hybrid-Domain Outer-Product Based Floating-Point SRAM Computing-in-Memory Macro with Logarithm Bit-Width Residual ADC. Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 576-578.
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