Efficiency and load capacity are critical for stable computing system operation. To address the need for compact integration and scalability, miniaturized power modules with integrated power devices in chip-sized packages are essential. These modules reduce component count and board space while maintaining high conversion efficiency and scalability for varying system loads. This work introduces a reconfigurable switched-capacitor (SC) hybrid converter topology designed for system-in-package (SiP) power modules. The DC-DC module, featuring a single inductor and capacitor directly mounted over the silicon die, achieves an enhanced output current (IOUT) to inductor current (IL,DC) ratio of up to 2. It provides a continuous adjustable voltage conversion ratio (VCR) range, generating 0.4 to 1.5V output at 1.8V input, with 96.7% efficiency and the capability to deliver 2.5A with a single module. Interleaving three modules achieves 94.3% efficiency with a maximum 6A IOUT, and ?VOUT reduction up to 60% through intrinsic properties of output capacitance (COUT) augmentation. In addition, a fully integrated gate driving scheme utilizing an on-chip high-frequency charge pump (QP) and globally shared bootstrap capacitor (CBST) is proposed to generate domain-floating rails catering to gate voltage demands.