Residential College | false |
Status | 已發表Published |
Investigation of the Thermal-Force Coupling and Temperature Compensation of Embedded FBG Strain Sensor | |
Shen, Shunan1; Xiong, Li1; Pan, Hanwen1; Ge, Dankai1; Zhou, Wanhuan2; Guo, Yongxing1 | |
2024-07-01 | |
Source Publication | IEEE Sensors Journal |
ISSN | 1530-437X |
Volume | 24Issue:13Pages:20645-20654 |
Abstract | Embedded FBG strain sensor is fixed on the measured object when monitoring strain, and the wavelength variation of FBG caused by the thermal strain of the measured object is coupled with the wavelength variation caused by external force. In order to reveal the basic situation of the thermal-force coupling, three embedded FBG strain sensors were prepared. The suspended temperature compensation FBGs and packaged temperature compensation FBGs were arranged inside these sensors. Then these sensors were placed in the air and reinforced concrete respectively to conduct sensing and temperature characteristic experiments. The sensing characteristic experiment proves the effectiveness and good repeatability of the strain measurement of the sensor. The temperature experiments prove that the packaged temperature compensation method is obviously better than the suspended temperature compensation method; And after being embedded in reinforced concrete, these sensors are incompletely suppressed by the thermal expansion of the reinforced concrete, the temperature sensitivities of three strain FBGs have decreased by 1.594pm/°C, 1.664pm/°C, 1.365pm/°C, respectively, while the temperature sensitivities of temperature compensation FBGs are basically unchanged. |
Keyword | Embedded Fiber Bragg Grating (Fbg) Strain Sensor Reinforced Concrete Temperature Compensation Thermal Strain |
DOI | 10.1109/JSEN.2024.3399196 |
URL | View the original |
Indexed By | SCIE |
Language | 英語English |
WOS Research Area | Engineering ; Instruments & Instrumentation ; Physics |
WOS Subject | Engineering, Electrical & Electronic ; Instruments & Instrumentation ; Physics, Applied |
WOS ID | WOS:001280322500001 |
Publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141 |
Scopus ID | 2-s2.0-85193227856 |
Fulltext Access | |
Citation statistics | |
Document Type | Journal article |
Collection | Faculty of Science and Technology THE STATE KEY LABORATORY OF INTERNET OF THINGS FOR SMART CITY (UNIVERSITY OF MACAU) DEPARTMENT OF CIVIL AND ENVIRONMENTAL ENGINEERING |
Corresponding Author | Xiong, Li |
Affiliation | 1.Ministry of Education, Key Laboratory of Metallurgical Equipment and Control Technology, Wuhan University of Science and Technology, Wuhan, China 2.State Key Laboratory of Internet of Things for Smart City and the Department of Civil and Environmental Engineering, University of Macau, Macau, China |
Recommended Citation GB/T 7714 | Shen, Shunan,Xiong, Li,Pan, Hanwen,et al. Investigation of the Thermal-Force Coupling and Temperature Compensation of Embedded FBG Strain Sensor[J]. IEEE Sensors Journal, 2024, 24(13), 20645-20654. |
APA | Shen, Shunan., Xiong, Li., Pan, Hanwen., Ge, Dankai., Zhou, Wanhuan., & Guo, Yongxing (2024). Investigation of the Thermal-Force Coupling and Temperature Compensation of Embedded FBG Strain Sensor. IEEE Sensors Journal, 24(13), 20645-20654. |
MLA | Shen, Shunan,et al."Investigation of the Thermal-Force Coupling and Temperature Compensation of Embedded FBG Strain Sensor".IEEE Sensors Journal 24.13(2024):20645-20654. |
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