| Residential College | false |
| Status | 已發表Published |
| Title | A Scalable Parallel Solution for Thermal Simulation of 2.5-D Chip Packages on 3D Unstructured Meshes |
| Author | Huimin Xu
|
| Subtype | 硕士Master |
| Thesis Advisor | Li Luo |
| Date Issued | 2024-07 |
| Degree Grantor | University of Macau |
| Place of Conferral | Macau |
| Degree Name | Master of Science |
| Funding Project | Preconditioning techniques for nonlinear systems ; Highly parallel preconditioned inexact Newton methods for nonlinear system of equations |
| Language | 英語English |
| Document Type | Thesis |
| Collection | DEPARTMENT OF MATHEMATICS |
| Recommended Citation GB/T 7714 | Huimin Xu. A Scalable Parallel Solution for Thermal Simulation of 2.5-D Chip Packages on 3D Unstructured Meshes[D]. Macau, University of Macau, 2024. |
| Files in This Item: | There are no files associated with this item. | |||||
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