Residential College | false |
Status | 已發表Published |
Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications | |
Kuo C.-T.1; Yip M.-C.1; Chiang K.-N.1; Tsou C.2 | |
2005 | |
Source Publication | Journal of Electronic Materials |
ISSN | 03615235 |
Volume | 34Issue:3Pages:272-281 |
Abstract | The thermo-mechanical testing of the type HPP ST polyimide films with high performance, supplied by Dupont, was realized under different strain rates and temperature effects. Therefore, the rate-temperature-dependent stress-strain behavior of materials was investigated and the dependence of the Young's modulus on temperature and strain rate was reported. In view of the uncertainty of the Young's modulus determination, the specimens were tested with the unloading-reloading technique to verify the test results. The constant strain rate uniaxial tensile test and long-time creep test at various temperatures were performed to characterize the time-temperature-dependent mechanical property precisely. The cyclic loading test was also implemented on the specimen to investigate cyclic stress-strain behavior. In addition, the nanoindentation test was carried out at room temperature to validate the elastic modulus derived from the uniaxial tensile test. This research is expected to investigate the time-temperature-dependent mechanical behavior of the polyimide materials for different service regimes including tensile and cyclic mechanical loading under elevated temperature in a systematic manner. |
Keyword | Creep Fatigue Polyimide Films Strain Rate Thermo-mechanical Testing |
DOI | 10.1007/s11664-005-0213-3 |
URL | View the original |
Language | 英語English |
WOS ID | WOS:000228028700007 |
Scopus ID | 2-s2.0-17144398817 |
Fulltext Access | |
Citation statistics | |
Document Type | Journal article |
Collection | University of Macau |
Affiliation | 1.National Tsing Hua University 2.Feng Chia University |
Recommended Citation GB/T 7714 | Kuo C.-T.,Yip M.-C.,Chiang K.-N.,et al. Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications[J]. Journal of Electronic Materials, 2005, 34(3), 272-281. |
APA | Kuo C.-T.., Yip M.-C.., Chiang K.-N.., & Tsou C. (2005). Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications. Journal of Electronic Materials, 34(3), 272-281. |
MLA | Kuo C.-T.,et al."Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications".Journal of Electronic Materials 34.3(2005):272-281. |
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