The Ni/Sn/Ni and Ni/Sn-0.7wt.%Cu/Ni couples are reacted at 200°C for various lengths of time. The tensile strengths of these annealed specimens are determined at room temperature. In addition, the interfacial reactions and fracture surfaces of the specimens are examined as well. These properties are important for the evaluation of the usage of Sn-0.7wt.%Cu lead-free solders, which has been not available in the literature. Only the NiSn phase is formed at the Sn/Ni interface, but both the CuSn and NiSn phases are formed at the Sn-0.7wt%Cu/Ni interface. The thickness of the intermetallic compound layers grows, while the joint strength decreases with longer reaction time. With a 1-h reaction at 200°C, the fracture surface is in the solder matrix for both of the two kinds of couples. Shifting toward the compound layer with longer reaction time, the fracture surface is in the NiSn layer in the Sn/Ni couple and is at the interface between the CuSn and NiSn in the Sn-0.7wt.%Cu/Ni after reacting at 200°C for 240 h.