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Feature Extraction for 3-D Palmprint Recognition: A Survey
Fei,Lunke1; Zhang,Bob1; Jia,Wei1; Wen,Jie2; Zhang,David3
2020-01-06
Source PublicationIEEE Transactions on Instrumentation and Measurement
ISSN0018-9456
Volume69Issue:3Pages:645-656
Abstract

The 3-D palmprint recognition has been investigated for over ten years, and various methods have been proposed for 3-D palmprint recognition. In this article, we present a comprehensive overview of feature extraction and matching for 3-D palmprint recognition over the past decade. First, we introduce the 3-D palmprint data acquisition and preprocessing processes. Second, we comparatively study the state-of-the-art feature extraction schemes for 3-D palmprint recognition. Third, we conduct selected experiments to comparatively analyze the representative 3-D palmprint feature descriptors. Finally, we offer selected potential directions for 3-D palmprint recognition in future work. We believe that this article provides a helpful guide to researchers working in the fields of palmprint-based and 3-D-based biometrics.

Keyword3-d Palmprint Recognition Biometric Feature Extraction And Matching Survey
DOI10.1109/TIM.2020.2964076
URLView the original
Indexed BySCIE
Language英語English
WOS Research AreaEngineering ; Instruments & Instrumentation
WOS SubjectEngineering, Electrical & Electronic ; Instruments & Instrumentation
WOS IDWOS:000515770800001
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141 USAIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141 USA
Scopus ID2-s2.0-85079612441
Fulltext Access
Citation statistics
Document TypeJournal article
CollectionFaculty of Science and Technology
DEPARTMENT OF COMPUTER AND INFORMATION SCIENCE
Corresponding AuthorZhang,Bob
Affiliation1.Department of Computer and Information Science,University of Macau,Taipa,999078,Macao
2.School of Computer and Information,Hefei University of Technology,Hefei,230009,China
3.School of Science and Engineering,Chinese University of Hong Kong,Shenzhen, Shenzhen,518172,Hong Kong
First Author AffilicationUniversity of Macau
Corresponding Author AffilicationUniversity of Macau
Recommended Citation
GB/T 7714
Fei,Lunke,Zhang,Bob,Jia,Wei,et al. Feature Extraction for 3-D Palmprint Recognition: A Survey[J]. IEEE Transactions on Instrumentation and Measurement, 2020, 69(3), 645-656.
APA Fei,Lunke., Zhang,Bob., Jia,Wei., Wen,Jie., & Zhang,David (2020). Feature Extraction for 3-D Palmprint Recognition: A Survey. IEEE Transactions on Instrumentation and Measurement, 69(3), 645-656.
MLA Fei,Lunke,et al."Feature Extraction for 3-D Palmprint Recognition: A Survey".IEEE Transactions on Instrumentation and Measurement 69.3(2020):645-656.
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