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Propagation characteristics of corrugated substrate integrated waveguide with no metallic vias
Liu, Zheng1; Zhu, Lei2; Xiao, Gao Biao1
2016-07-05
Conference Name2016 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition, iWEM 2016
Source Publication2016 IEEE International Workshop on Electromagnetics, iWEM 2016 - Proceeding
Conference Date5 16, 2016 - 5 18, 2016
Conference PlaceNanjing, Jiangsu, China
Author of SourceInstitute of Electrical and Electronics Engineers Inc.
Abstract

In this paper, a corrugated substrate integrated waveguide (CSIW) with no metallic vias is proposed, and its propagation characteristics are investigated via our numerical SOC de-embedding method. In our analysis, dominant operating modes in this CSIW at different frequencies are extensively discussed. In final, its complex propagation constant, i.e., phase and attenuation constants, is derived to demonstrate its frequency-dispersive transmission and attenuation performance. © 2016 IEEE.

KeywordCorrugated Integrated Waveguide (Csiw) With No Vias Propagation Constant Short-open Calibration (Soc)
DOI10.1109/iWEM.2016.7504977
URLView the original
Indexed ByCPCI-S
Language英語English
WOS Research AreaEngineering ; Telecommunications
WOS SubjectEngineering, Electrical & Electronic ; Telecommunications
WOS IDWOS:000386979800101
Scopus ID2-s2.0-84982852189
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Citation statistics
Document TypeConference paper
CollectionDEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
Affiliation1.Shanghai JiaoTong University, Shanghai, China;
2.University of Macau, China
Recommended Citation
GB/T 7714
Liu, Zheng,Zhu, Lei,Xiao, Gao Biao. Propagation characteristics of corrugated substrate integrated waveguide with no metallic vias[C]. Institute of Electrical and Electronics Engineers Inc., 2016.
APA Liu, Zheng., Zhu, Lei., & Xiao, Gao Biao (2016). Propagation characteristics of corrugated substrate integrated waveguide with no metallic vias. 2016 IEEE International Workshop on Electromagnetics, iWEM 2016 - Proceeding.
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