The constantly growing demand for accuracy, efficiency, dependency, and universality in the simulation and circuit modeling of any functional electromagnetic structure-whether devices, circuits, antennas, interconnects, or packaging [1]-[5]-has for decades been the driving force in the development of a number of successful electromagnetic simulation and circuit modeling packages available on the commercial market. In particular, the current trend toward high-density integrations of electromagnetic geometries, from composite-material-based electrical aircraft to nanomaterial-structured electromagnetic sensors, is spurring thedevelopment of various sophisticated multiscale and multiphysics algorithms for rigorous field simulations and design modeling. © 2000-2012 IEEE.