Residential College | false |
Status | 已發表Published |
Recent Advances in High-Resolution Hybrid Discrete-Time Noise-Shaping ADCs | |
Jiang, D.; Sin, S. W.; Qi, L.; Wang, G.; Martins, R. P. | |
2021-10-01 | |
Source Publication | IEEE Open Journal of the Solid-State Circuits Society |
ISSN | 2644-1349 |
Pages | 129-139 |
Abstract | High precision data acquisition requires very-high-resolution Analog-to-digital converters (ADC) for kHz speed or to keep a relatively high resolution for wider bandwidth (BW) around the MHz range. Although widely used, noise-shaping (NS) in ADCs offers a high-resolution characteristic, but obtaining good power efficiency and compact die area is still challenging. Recent literature showed promising progress by utilizing hybrid Discrete-Time (DT) NS-ADCs with measured silicon results. This paper focuses its analysis and discussion on two important trending classes: hybrid Incremental ADCs (I-ADC) and hybrid Time-interleaved (TI) NS-ADCs. Furthermore, this paper presents a review and addresses the benefits of those hybrid architectures. |
Keyword | ADC analog-to-digital converter DAC digital-to-analog-converter hybrid ADC incremental ADC (I-ADC) delta-sigma modulator time-Interleaving extrapolating noise shaping successive approximation register SAR. |
URL | View the original |
Language | 英語English |
The Source to Article | PB_Publication |
PUB ID | 62045 |
Document Type | Journal article |
Collection | University of Macau |
Corresponding Author | Sin, S. W. |
Recommended Citation GB/T 7714 | Jiang, D.,Sin, S. W.,Qi, L.,et al. Recent Advances in High-Resolution Hybrid Discrete-Time Noise-Shaping ADCs[J]. IEEE Open Journal of the Solid-State Circuits Society, 2021, 129-139. |
APA | Jiang, D.., Sin, S. W.., Qi, L.., Wang, G.., & Martins, R. P. (2021). Recent Advances in High-Resolution Hybrid Discrete-Time Noise-Shaping ADCs. IEEE Open Journal of the Solid-State Circuits Society, 129-139. |
MLA | Jiang, D.,et al."Recent Advances in High-Resolution Hybrid Discrete-Time Noise-Shaping ADCs".IEEE Open Journal of the Solid-State Circuits Society (2021):129-139. |
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