UM
Patent NumberCN102312217B
Status已授權 Granted
采用复合模式生长半导体薄膜的方法及装置
2013-04-17
Application NumberCN201110262400.6
Application Date2011-09-06
Rights Holder中国科学院长春光学精密机械与物理研究所
单崇新; 鞠振刚; 倪佩楠; 李炳辉; 王双鹏; 申德振
Date Available2013-04-17
Country中国 China
Abstract复合模式生长半导体薄膜的方法及装置,涉及半导体材料生长技术及设备制造领域。解决现有技术制备方法制备的薄膜结晶质量差、生产速率慢的问题。通入ALD反应前驱体A在衬底表面形成单原子层;再通入ALD反应前驱体B与ALD反应前驱体A反应,形成单层A-B薄膜;重复以上步骤形成多层的-A-B-A-B-A-B-薄膜;然后同时通入MOCVD反应前驱体A和MOCVD反应前驱体B在衬底上方发生化学反应,再与多层的-A-B-A-B-A-B-薄膜结合,获得复合模式生长的半导体薄膜。本方法有效结合两种生长方式的优点,实现两种生长模式的复合生长模式,易于大规模的工业化生产。本发明还提供了复合模式生长半导体薄膜的装置。
Language中文Chinese
Open (Notice) NumberCN102312217B
IPC Classification NumberC23C16/44 ; C23C16/455
Patent Agent陶尊新
Agency长春菁华专利商标代理事务所 22210
Document TypePatent
CollectionUniversity of Macau
Recommended Citation
GB/T 7714
单崇新,鞠振刚,倪佩楠,等. 采用复合模式生长半导体薄膜的方法及装置. CN102312217B[P]. 2013-04-17.
APA 单崇新., 鞠振刚., 倪佩楠., 李炳辉., 王双鹏., & 申德振 (2011-09-06). 采用复合模式生长半导体薄膜的方法及装置.
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