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Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers Journal article
Peng, Zhen Jia, Li, Zhe, Jiao, Yu, Zhang, Ning, Zhang, Qi, Zhou, Binbin, Gao, Li Yin, Fu, Xian Zhu, Liu, Zhi Quan, Sun, Rong. Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers[J]. Nano Materials Science, 2024.
Authors:  Peng, Zhen Jia;  Li, Zhe;  Jiao, Yu;  Zhang, Ning;  Zhang, Qi; et al.
Favorite | TC[Scopus]:0  IF:12.6/12.4 | Submit date：2024/08/05
Additive Ad/desorption And Interactions  Copper Interconnect Electroplating  In Situ Raman Spectroelectrochemistry  Low Aspect-ratio Via Fill  Quantum Chemical Computation  
Band structure engineering in metal halide perovskite nanostructures for optoelectronic applications Journal article
Ou, Qingdong, Bao, Xiaozhi, Zhang, Yinan, Shao, Huaiyu, Xing, Guichuan, Li, Xiangping, Shao, Liyang, Bao, Qiaoliang. Band structure engineering in metal halide perovskite nanostructures for optoelectronic applications[J]. Nano Materials Science, 2019, 1(4), 268-287.
Authors:  Ou, Qingdong;  Bao, Xiaozhi;  Zhang, Yinan;  Shao, Huaiyu;  Xing, Guichuan; et al.
Favorite | TC[WOS]:132 TC[Scopus]:146  IF:12.6/12.4 | Submit date：2021/09/10
Band Structure Engineering  Doping  Heterostructures  Optoelectronic Applications  Perovskite Nanostructures