×
验证码:
换一张
Forgotten Password?
Stay signed in
Login With UMPASS
English
|
繁體
Login With UMPASS
Log In
ALL
ORCID
TI
AU
PY
SU
KW
TY
JN
DA
IN
PB
FP
ST
SM
Study Hall
Image search
Paste the image URL
Home
Faculties & Institutes
Scholars
Publications
Subjects
Statistics
News
Search in the results
Faculties & Institutes
INSTITUTE OF MIC... [1]
Authors
LAM CHI SENG [1]
Document Type
Patent [1]
Date Issued
2024 [1]
Language
Source Publication
Indexed By
Funding Organization
Funding Project
×
Knowledge Map
UM
Start a Submission
Submissions
Unclaimed
Claimed
Attach Fulltext
Bookmarks
Browse/Search Results:
1-1 of 1
Help
Selected(
0
)
Clear
Items/Page:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
Sort:
Select
Issue Date Ascending
Issue Date Descending
Submit date Ascending
Submit date Descending
Author Ascending
Author Descending
Journal Impact Factor Ascending
Journal Impact Factor Descending
Title Ascending
Title Descending
WOS Cited Times Ascending
WOS Cited Times Descending
一种开关电容网络带隙电压基准电路及其温度补偿方法
Patent
专利类型: 发明专利 Invention, 专利号: 202410457322.2, 申请日期: 2024-04-16,
Authors:
余志桦
;
李俊辉
;
张政浩
;
林智聲
;
罗文基
; et al.
Favorite
|
|
Submit date：2024/08/26
