×
验证码:
换一张
Forgotten Password?
Stay signed in
Login With UMPASS
English
|
繁體
Login With UMPASS
Log In
ALL
ORCID
TI
AU
PY
SU
KW
TY
JN
DA
IN
PB
FP
ST
SM
Study Hall
Home
Faculties & Institutes
Scholars
Publications
Subjects
Statistics
News
Search in the results
Faculties & Institutes
INSTITUTE OF APP... [3]
Faculty of Scien... [1]
Authors
VAI MANG I [1]
PUN SIO HANG [1]
MAK PENG UN [1]
SHAO HUAIYU [1]
Document Type
Journal article [6]
Date Issued
2024 [2]
2022 [1]
2019 [1]
2008 [2]
Language
英語English [6]
Source Publication
Huagong Xuebao/J... [1]
IEICE Electronic... [1]
Materials [1]
Nano Energy [1]
Nano Materials S... [1]
Thin Solid Films [1]
More...
Indexed By
SCIE [3]
ESCI [1]
Funding Organization
Funding Project
×
Knowledge Map
UM
Start a Submission
Submissions
Unclaimed
Claimed
Attach Fulltext
Bookmarks
Browse/Search Results:
1-6 of 6
Help
Selected(
0
)
Clear
Items/Page:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
Sort:
Select
Issue Date Ascending
Issue Date Descending
Submit date Ascending
Submit date Descending
Journal Impact Factor Ascending
Journal Impact Factor Descending
Title Ascending
Title Descending
Author Ascending
Author Descending
WOS Cited Times Ascending
WOS Cited Times Descending
Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding
Journal article
Li, Wenjie, Li, Zhe, Zeng, Fang Yuan, Zhang, Qi, Guo, Liwei, Li, Dan, Ma, Yong Hui, Liu, Zhi Quan. Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding[J]. Materials, 2024, 17(22), 5405.
Authors:
Li, Wenjie
;
Li, Zhe
;
Zeng, Fang Yuan
;
Zhang, Qi
;
Guo, Liwei
; et al.
Favorite
|
TC[WOS]:
0
TC[Scopus]:
0
IF:
3.1
/
3.4
|
Submit date:2024/12/26
Additive Adsorption
Cu Pillar Bumps
Interfacial Reaction
Kirkendall Voiding
Packaging Substrate Electroplating
Polyquaterntum Leveler
Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers
Journal article
Peng, Zhen Jia, Li, Zhe, Jiao, Yu, Zhang, Ning, Zhang, Qi, Zhou, Binbin, Gao, Li Yin, Fu, Xian Zhu, Liu, Zhi Quan, Sun, Rong. Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers[J]. Nano Materials Science, 2024.
Authors:
Peng, Zhen Jia
;
Li, Zhe
;
Jiao, Yu
;
Zhang, Ning
;
Zhang, Qi
; et al.
Favorite
|
TC[Scopus]:
2
IF:
12.6
/
12.4
|
Submit date:2024/08/05
Copper Interconnect Electroplating
Low Aspect-ratio Via Fill
Additive Ad/desorption And Interactions
In Situ Raman Spectroelectrochemistry
Quantum Chemical Computation
Regulating zinc electroplating chemistry to achieve high energy coaxial fiber Zn ion supercapacitor for self-powered textile-based monitoring system
Journal article
Zhao, Jingxin, Cong, Zifeng, Hu, Jun, Lu, Hongyu, Wang, Litong, Wang, Huibo, Malyi, Oleksandr I., Pu, Xiong, Zhang, Yanyan, Shao, Huaiyu, Tang, Yuxin, Wang, Zhong Lin. Regulating zinc electroplating chemistry to achieve high energy coaxial fiber Zn ion supercapacitor for self-powered textile-based monitoring system[J]. Nano Energy, 2022, 93(106893).
Authors:
Zhao, Jingxin
;
Cong, Zifeng
;
Hu, Jun
;
Lu, Hongyu
;
Wang, Litong
; et al.
Favorite
|
TC[WOS]:
50
TC[Scopus]:
52
IF:
16.8
/
16.3
|
Submit date:2022/03/28
Fiber-shaped Zn Anode
Electroplating Chemistry
Coaxial Fiber-shaped Zn-ion Hybrid Super- Capacito
Self-powered Textile-based Monitoring System
Fabrication of embossed capacitive micromachined ultrasonic transducers using sacrificial release process
Journal article
Yu,Yuanyu, Wang,Jiujiang, Pun,Sio Hang, Cheng,Ching Hsiang, Lei,Kin Fong, Vai,Mang I., Zhang,Shuang, Mak,Peng Un. Fabrication of embossed capacitive micromachined ultrasonic transducers using sacrificial release process[J]. IEICE Electronics Express, 2019, 16(2).
Authors:
Yu,Yuanyu
;
Wang,Jiujiang
;
Pun,Sio Hang
;
Cheng,Ching Hsiang
;
Lei,Kin Fong
; et al.
Favorite
|
TC[WOS]:
3
TC[Scopus]:
5
IF:
0.8
/
0.7
|
Submit date:2021/03/11
Embossed Capacitive Micromachined Ultrasonic Transducer
Nickel Electroplating
Sacrificial Release Process
Electrocatalytic oxidation of hydrazine compound on electroplated Pd/WO3 film
Journal article
Ye W., Yang B., Cao G., Duan L., Wang C.. Electrocatalytic oxidation of hydrazine compound on electroplated Pd/WO3 film[J]. Thin Solid Films, 2008, 516(10), 2957-2961.
Authors:
Ye W.
;
Yang B.
;
Cao G.
;
Duan L.
;
Wang C.
Favorite
|
TC[WOS]:
24
TC[Scopus]:
24
|
Submit date:2018/11/07
Anodic Oxidation
Electroplating
Hydrazine
Pd/wo3 Films
Preparation of porous silicon microreactor components integrated with microheater and noble metal catalyst
Journal article
Chang Y., Su X., Ma C., Wang C.. Preparation of porous silicon microreactor components integrated with microheater and noble metal catalyst[J]. Huagong Xuebao/Journal of Chemical Industry and Engineering (China), 2008, 59(2), 354-358.
Authors:
Chang Y.
;
Su X.
;
Ma C.
;
Wang C.
Favorite
|
|
Submit date:2018/11/07
Distributed production
Electroless deposition
Electroplating
Microheater
Microreactor
Monocrystal silicon
Porous silicon