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Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding Journal article
Li, Wenjie, Li, Zhe, Zeng, Fang Yuan, Zhang, Qi, Guo, Liwei, Li, Dan, Ma, Yong Hui, Liu, Zhi Quan. Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding[J]. Materials, 2024, 17(22), 5405.
Authors:  Li, Wenjie;  Li, Zhe;  Zeng, Fang Yuan;  Zhang, Qi;  Guo, Liwei; et al.
Favorite | TC[WOS]:0 TC[Scopus]:0  IF:3.1/3.4 | Submit date：2024/12/26
Additive Adsorption  Cu Pillar Bumps  Interfacial Reaction  Kirkendall Voiding  Packaging Substrate Electroplating  Polyquaterntum Leveler  
Dual-function CoP on nitrogen doped carbon framework with induced interfacial coupling for overall water splitting Journal article
Zhang, Manting, Zhou, Tingting, Huang, Gang, Han, Fengyan, Shao, Huaiyu, Hu, Ting, Wang, Caiqin. Dual-function CoP on nitrogen doped carbon framework with induced interfacial coupling for overall water splitting[J]. Surfaces and Interfaces, 2024, 47, 104224.
Authors:  Zhang, Manting;  Zhou, Tingting;  Huang, Gang;  Han, Fengyan;  Shao, Huaiyu; et al.
Favorite | TC[WOS]:1 TC[Scopus]:3  IF:5.7/5.8 | Submit date：2024/05/02
Cop/nc Nanocatalysts  Doping  Hydrogen Evolution Reaction  Interfacial Coupling Effect  Oxygen Evolution Reaction