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Comparison of different types of TRM composites for strengthening masonry panels Journal article
Wang, X., Lam, C .C., Iu, V. P.. Comparison of different types of TRM composites for strengthening masonry panels[J]. Construction and Building Materials, 2019, 219, 184-194.
Authors:  Wang, X.;  Lam, C .C.;  Iu, V. P.
Favorite | TC[WOS]:48 TC[Scopus]:60  IF:7.4/8.0 | Submit date：2021/03/09
Fabrics/textiles  Masonry  Mechanical Testing  Textile Reinforced Mortars  
Comparison of different types of TRM composites for strengthening masonry panels Journal article
Wang, X, Lam, C. C., Iu, V. P.. Comparison of different types of TRM composites for strengthening masonry panels[J]. Journal of Construction and Building Materials, 2019, 184-194.
Authors:  Wang, X;  Lam, C. C.;  Iu, V. P.
Favorite | TC[WOS]:48 TC[Scopus]:60  IF:7.4/8.0 | Submit date：2022/08/06
Fabris  Textiles  Mechanical Testing  Masonry  Textile Reinforced Mortars  
Mechanical properties of calcium silicate hydrate (C-S-H) at nano-scale: A molecular dynamics study Journal article
Hou D., Zhu Y., Lu Y., Li Z.. Mechanical properties of calcium silicate hydrate (C-S-H) at nano-scale: A molecular dynamics study[J]. Materials Chemistry and Physics, 2014, 146(3), 503-511.
Authors:  Hou D.;  Zhu Y.;  Lu Y.;  Li Z.
Favorite | TC[WOS]:152 TC[Scopus]:168 | Submit date：2019/04/08
Mechanical Properties  Mechanical Testing  Molecular Dynamics  Nanostructures  
Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications Journal article
Kuo C.-T., Yip M.-C., Chiang K.-N., Tsou C.. Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications[J]. Journal of Electronic Materials, 2005, 34(3), 272-281.
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Tsou C.
Favorite | TC[WOS]:13 TC[Scopus]:15 | Submit date：2019/04/08
Creep  Fatigue  Polyimide Films  Strain Rate  Thermo-mechanical Testing  
Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging applications Journal article
Kuo C.-T., Yip M.-C., Chiang K.-N.. Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging applications[J]. Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an, 2004, 27(7), 949-954.
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
Favorite | TC[WOS]:3 TC[Scopus]:3 | Submit date：2019/04/08
Creep  Polyimide Films  Strain Rate  Thermo-mechanical Testing  
Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application Conference paper
Kuo C.-T., Yip M.-C., Chiang K.-N.. Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application[C], 2003, 473-483.
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
Favorite |  | Submit date：2019/04/08
Creep  Strain rate  Thermo-mechanical testing  Underfill films