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Journal article [1]
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2003 [1]
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英語English [1]
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Journal of Elect... [1]
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Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints
Journal article
Chen S.-W., Lee S.-W., Yip M.-C.. Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints[J]. Journal of Electronic Materials, 2003, 32(11), 1284-1289.
Authors:
Chen S.-W.
;
Lee S.-W.
;
Yip M.-C.
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Submit date：2019/04/08
Interfacial Reactions
Mechanical Properties
Ni/sn/ni
Sn-cu Solder
