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Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding Journal article
Li, Wenjie, Li, Zhe, Zeng, Fang Yuan, Zhang, Qi, Guo, Liwei, Li, Dan, Ma, Yong Hui, Liu, Zhi Quan. Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding[J]. Materials, 2024, 17(22), 5405.
Authors:  Li, Wenjie;  Li, Zhe;  Zeng, Fang Yuan;  Zhang, Qi;  Guo, Liwei; et al.
Favorite | TC[WOS]:0 TC[Scopus]:0  IF:3.1/3.4 | Submit date：2024/12/26
Additive Adsorption  Cu Pillar Bumps  Interfacial Reaction  Kirkendall Voiding  Packaging Substrate Electroplating  Polyquaterntum Leveler  
Exploring the Performance of Hall Sensor with Substrate Bias Modulation in SOI Process Journal article
Cao, Boyang, Lei, Ka Meng, Zou, Hengchen, Martins, Rui P., Mak, Pui In. Exploring the Performance of Hall Sensor with Substrate Bias Modulation in SOI Process[J]. IEEE Sensors Journal, 2024, 24(17), 27365-27372.
Authors:  Cao, Boyang;  Lei, Ka Meng;  Zou, Hengchen;  Martins, Rui P.;  Mak, Pui In
Favorite | TC[WOS]:1 TC[Scopus]:0  IF:4.3/4.2 | Submit date：2024/08/05
Cmos  Cross Plate  Horizontal Hall Sensor  Substrate-biased  
Packaged Millimeter Wave On Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25 μm GaAs pHEMT Technology Journal article
Zhou, Xin, Zhang, Gang, Tam, Kam Weng, Chen, Shichang, Zhang, Zhuowei, Fu, Xiaodong. Packaged Millimeter Wave On Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25 μm GaAs pHEMT Technology[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14(8), 1454-1460.
Authors:  Zhou, Xin;  Zhang, Gang;  Tam, Kam Weng;  Chen, Shichang;  Zhang, Zhuowei; et al.
Favorite | TC[WOS]:1 TC[Scopus]:3  IF:2.3/2.1 | Submit date：2024/07/04
Bandpass Filter (Bpf)  Gaas Technology  Hybrid Structure  On-chip, Substrate Integrated Waveguide (Siw)  Transmission Zero (Tz)  
Multi-layer SIW vertical transition and its applications in wideband crossover and monopulse comparator Journal article
Qiu, Lei Lei, Wu, Yueyang, Huang, Shengxiang, Deng, Lianwen, Ouyang, Zhao An, Zhu, Lei. Multi-layer SIW vertical transition and its applications in wideband crossover and monopulse comparator[J]. Engineering Science and Technology, an International Journal, 2024, 56, 101776.
Authors:  Qiu, Lei Lei;  Wu, Yueyang;  Huang, Shengxiang;  Deng, Lianwen;  Ouyang, Zhao An; et al.
Favorite | TC[WOS]:0 TC[Scopus]:0  IF:5.1/4.8 | Submit date：2024/08/05
Crossover  Miniaturized  Monopulse Comparator  Substrate Integrated Waveguide (Siw)  Vertical Transition  Wideband  
Highly Selective Filtennas With Wide-Stopband Based on Multifunctional Slots Loaded Substrate-Integrated Cavity Journal article
Zhou, Xin, Zhang, Gang, Tam, Kam Weng, Lin, Huawei, Zhang, Zhuowei. Highly Selective Filtennas With Wide-Stopband Based on Multifunctional Slots Loaded Substrate-Integrated Cavity[J]. IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2024, 72(7), 5520-5529.
Authors:  Zhou, Xin;  Zhang, Gang;  Tam, Kam Weng;  Lin, Huawei;  Zhang, Zhuowei
Favorite | TC[WOS]:2 TC[Scopus]:2  IF:4.6/5.0 | Submit date：2024/07/04
Filtenna  Highly Selective  Radiation Null (Rn)  Substrate-integrated Cavity (Sic)  Wide-stopband  
Millimetre-wave on-chip SIW filtering crossover using 0.25 µm GaAs pHEMT technology Journal article
Zhou, Xin, Lu, Siyuan, Li, Desen, Ding, Daqi, Chio, Chi Hou, Tam, Kam Weng. Millimetre-wave on-chip SIW filtering crossover using 0.25 µm GaAs pHEMT technology[J]. Electronics Letters, 2024, 60(14), e13288.
Authors:  Zhou, Xin;  Lu, Siyuan;  Li, Desen;  Ding, Daqi;  Chio, Chi Hou; et al.
Favorite | TC[WOS]:0 TC[Scopus]:0  IF:0.7/0.9 | Submit date：2024/08/05
Filtering Crossover  Gallium Arsenide  Millimetre-wave  Substrate Integrated Waveguide  
A Differential-Fed Dual-Polarized Microstrip Patch Filtering Antenna Based on Dual-Mode SIW Cavity Conference paper
Yu, Hao, Qian, Suchuan, Zhou, Xin, Gu, Hongtao, Zhang, Gang. A Differential-Fed Dual-Polarized Microstrip Patch Filtering Antenna Based on Dual-Mode SIW Cavity[C]:Institute of Electrical and Electronics Engineers Inc., 2024, 381-383.
Authors:  Yu, Hao;  Qian, Suchuan;  Zhou, Xin;  Gu, Hongtao;  Zhang, Gang
Favorite | TC[WOS]:0 TC[Scopus]:0 | Submit date：2024/08/05
Dual-polarized  Filtering Antenna  Isolation  Patch  Radiation Null  Substrate Integrated Waveguide (Siw)  
Design of Folded SIW Cavity-Fed Miniaturized Microstrip Patch Filtering Antenna Conference paper
Zhou, Xin, Yu, Hao, Ban, Yingying, Qian, Suchuan, Zhang, Zhuowei, Zhang, Gang, Tam, Kam Weng. Design of Folded SIW Cavity-Fed Miniaturized Microstrip Patch Filtering Antenna[C]:Institute of Electrical and Electronics Engineers Inc., 2024.
Authors:  Zhou, Xin;  Yu, Hao;  Ban, Yingying;  Qian, Suchuan;  Zhang, Zhuowei; et al.
Favorite | TC[WOS]:0 TC[Scopus]:0 | Submit date：2024/12/05
Filtering Antenna  Folded  Miniaturized  Patch  Substrate Integrated Waveguide (Siw)  
Characterization of laser surface-alloyed Ti-Ni-Ag coatings and evaluation of their corrosion and antibacterial performance Journal article
Qiao, Q., Cristino, V. A.M., Tam, L. M., Chang, W. W., Qian, H. C., Zhang, D. W., Kwok, C. T.. Characterization of laser surface-alloyed Ti-Ni-Ag coatings and evaluation of their corrosion and antibacterial performance[J]. Surface and Coatings Technology, 2023, 474, 130119.
Authors:  Qiao, Q.;  Cristino, V. A.M.;  Tam, L. M.;  Chang, W. W.;  Qian, H. C.; et al.
Adobe PDF | Favorite | TC[WOS]:5 TC[Scopus]:5  IF:5.3/4.9 | Submit date：2024/01/02
Antibacterial Efficacy  Corrosion  Hardness  Laser Surface Alloying  Ti-ni-ag Coatings  Tini Substrate  
Effect of Roughness on the Bond Behavior between Ultrahigh-Performance Engineered Cementitious Composites and Old Concrete Journal article
Zhang, Cong, Wu, Lishan, Yu, Zhihui, Gu, Jiaming, Ukrainczyk, Neven, Cai, Jingming. Effect of Roughness on the Bond Behavior between Ultrahigh-Performance Engineered Cementitious Composites and Old Concrete[J]. Journal of Materials in Civil Engineering, 2023, 35(8), 04023268.
Authors:  Zhang, Cong;  Wu, Lishan;  Yu, Zhihui;  Gu, Jiaming;  Ukrainczyk, Neven; et al.
Favorite | TC[WOS]:4 TC[Scopus]:4  IF:3.1/3.6 | Submit date：2023/09/04
Bond Behavior  Concrete Substrate  Roughness  Single-side Shear Test  Splitting Tensile Test  Ultrahigh-performance Engineered Cementitious Composite (Uhp-ecc)